Hard Board Capabilities
Material:
Hi Tg and Standard FR-4
BT
Rogers
Polyimide
Getek and Getek II
Teflon
Finish:
HASL
Immersion Gold
Immersion Silver
Immersion Tin
Nickel
Tin/Nickel
OSP (Entek and Shikoku)
Feature:
0.003” Min. Lin Width
0.003” Min. Spacing
0.003” Layer to Layer
+/-7% PCB Thickness
+/- 0.005 Profile Dimensions
 
Drilling:
0.006” Finished Hole size
+/-0.002” hole tolerance
18:1 Max. Aspect Ratio
Other Capabilities:
Single and Double sided
Multi layer up to 32 layers
Sequential Lamination
28”X21” Max. Panel size
0.014” Min. Board Thickness
0.250” Max. Board Thickness
0.0025” Min. Core Thickness
6 oz Max. Copper weight
LPI Solder Mask
Solder Mask Colors available: Green, Red, Blue, Black, and Clear
 
Flex and Rigid-Flex Capabilities
Material:
DuPont Pyralux:
DuPont AP Copper Clad Laminates
DuPont LF and FR Coverlays and Bonding Plys
Hitachi:
Polyimide Laminates
Polyimide no-flow Prepreg
Arlon:
Laminates and No-flow prepreg
Isola:
Laminates and No-flow prepreg
Feature:
Layer Count: 4-32
Board Thickness: 0.006”-0.125”
Internal Imaging: 0.002”/0.002”
Min. Dielectric: 0.001”
Min. Copper: 9 Micron
Min. Drilled hole: 0.006”
Min. Laser Via: 0.004”
Aspect Ratio: >10:1
PTH Tolerance: +/-0.002”
Impedance Tolerance: +/-5%
Certificates and Accreditations:
Mil-PRF-31032
Mil-P-50884
Mil-P-55110
ISO 9001-2000
ISO 9001-2008
ITAR Registered
 
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