Hard Board Capabilities

Hard Board Capabilities
Military-High-Density-12-Layer-Board

Feature:

  • 0.003″ Min. Lin Width
  • 0.003″ Min. Spacing
  • 0.003″ Layer to Layer
  • +/- 7% PCB Thickness
  • +/- 0.005 Profile Dimensions

Material:

  • Hi Tg & Standard FR-4
  • BT
  • Rogers
  • Polyimide
  • Getek & Getek II
  • Teflon

Finish:

  • HASL
  • Immersion Gold
  • Immersion Silver
  • Immersion Tin
  • Nickel
  • OSP (Entek & Shikoku)

Drilling:

  • 0.006″ Finished Hole Size
  • +/- 0.002″ Hole Tolerance
  • 18:1 Max. Aspect Ratio

Other Capabilities:

  • Single & Double Sided
  • Multi Layer up to 32 Layers
  • Sequential Lamination
  • 28″x21′ Max. Panel Size
  • 0.014″ Min. Board Thickness
  • Max Core Thickness
  • 6 oz. Max. Copper Weight
  • LPI Solder Mask
  • Solder Mask Colors Available: Green, Red, Blue, Black, and Clear

Flex & Rigid-Flex Capabilities

SpectraCAD Engineering represents top of the line Flex and Rigid-Flex Manufacturer with capabilities as listed below:

Material:

SpectraCAD

DuPont Pyralux:

  • DuPont AP Copper Clad Laminates
  • DuPont LF & RF Coverlays & Bonding Plys

Hitachi:

  • Polyimide Laminates
  • Polyimide No-Flow Prepreg

Arlon:

  • Laminates & No-Flow Prepreg

Isola:

  • Laminates & No-Flow Prepreg
SpectraCAD

Feature:

  • Layer Count: 4-32
  • Board Thickness: 0.006″/0.002″
  • Internal Imaging: 0.002″/0.002″
  • Min. Dielectric: 0.001″
  • Min. Copper: 9 Micron
  • Min. Drilled Hole: 0.006″
  • Min. Laser Via: 0.004″
  • Aspect Ratio: >10:1
  • PTH Tolerance: +/-0.002″
  • Impedance Tolerance: +/- 5%

Certificates & Accreditations:

  • Mil-PRF-31032
  • Mil-P-50884
  • Mil-P-55110
  • ISO 9001-2000
  • ISO 9001-2008
  • ITAR Registered