Our Process

In the memory module industry, increasing the DRAM Capacity is a crucial parameter of success, when it comes to PCB layout and design. For this particular project, the SpectraCAD team was able to stack 2 Samsung BGA DRAMs by using a Flex PCB (FPC), and as a result, we doubled the density of the DRAM stick. This was a huge win for the client, as it translated directly to not only a more efficient product, but of course larger profitability in the end-application.